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OGSR Series Coil On-Board Contact / OGSR Series

Durable components for grounding against vibrations and repeated compressions.

Feature:

Durable components for grounding against repeated compressions.
Products with wide range of use.

Material:

Piano wire(0.45)(Au plating)
Brass(t=0.3mm)(Sn reflow plating).

 

 

     
     
OGC Series On-Board Clamp / OGC Series

Compact cables clamps applicable to automated mounting on PC board.

Feature:

Supporting wire harness on PC board.
Side and top insertion types are available.

Material:

Phosphor bronze for spring (Sn reflow plating)

 

 

     
     
OGCP Series On-Board Clip / OGCP Series

No soldering of shield can is required. Automated mounting applicable fixing parts.

Feature:

Clip structure enables shielding cans to be removable.
Multi-point contact grounding is provided for shielding cans.
Separate structure of clip and support portion resistant to side slide loading.(OGCP-1182435)

Material:

OGCP-1182435 Phosphor bronze for spring(Sn reflow plating/Primary plating Cu)
OGCP-650813R Phosphor bronze for spring(Sn reflow plating/Primary plating Cu)
OGCP-650813G Titanium Copper alloy(One side Au plating/The under plating by Ni)

 

 

     
     
OG Series On-Board Contact / OG Series

Super-compact grounding components with wide variations.

Feature:

Space saving, FG facilitated even where screws are precluded.
Automated mounting on PC board is applicable.
Box structure is introduced for distortion, deformation and damage prevention.(excluding some part numbers.)

 

 

     
     
OG-R Series On-Board Lug Terminal / OG-R Series

Secure contact of screwed area.

Feature:

FG reinforcement and reliable contact are achieved.
Prevention of screw loosening caused by vibration.
OG-RM is a space-saving fully-flat shape.
OG-RM30HF provides even further space saving.

Material:

Tough pitch copper (Sn plating).
OG-RM26 is made of brass.

 

 

     
     
OGP Series On-Board Plate / OGP Series

OGP configuration ensures reliable contact.

Feature:

OGP solves contact failure problems caused by solder flux.
Reliable contact is provided at FG reinforcement of PC board.

Material:

Brass (OGP-3216 / Au plating , OGP-4520 / Sn reflow plating).

 

 

     
     
OG-865028 On-Board Shielding Guide / OG-865028

Displacement prevention mechanism improves grounding of shielding cans.

Feature:

Guiding mechanism makes easy installation for shielding cans.
Applicable even at corners of shielding cans.
Multi-point contact with the shielding can provides higher shielding effectiveness.

Material:

Phosphor bronze for spring (Sn reflow plating)

 

 

     
     
OGSC-756030 Side Contact / OGSC-756030

Component for side-contact on PC board.

Feature:

Load on PC board is reduced compared with conventional vertical contact type.
Structure resists deformation even during lateral sliding.

Material:

Phosphor bronze for spring (Sn reflow plating).

 

 

     
   

   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   MEC is a division of Marcom Electronic Components (UK) Ltd.
   Copyright 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   MEC, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

ISOQAR
Cert: 4823
ISO 9001

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